Scholarship Repayment Terms
For the 2025 academic year, this page explains the repayment method, repayment period, interest, and fees for scholarships at the Tokyo Senju Campus Faculty of Engineering.
Repayment method, period, interest, and fees
Scholarship repayment is made in equal annual principal installments. The repayment period is five years, beginning in the academic year after you complete or withdraw from the master's or doctoral program. The scholarship is interest-free. Any fees related to repayment are paid by the scholarship recipient.
Official sources
The following official Tokyo Denki University materials were used to prepare this page.
- 2025 Student Handbook — School of Engineering (2025 academic year) — PDF page 306