Scholarship Loan Repayment Terms
This page explains how the scholarship loan is repaid, when repayment begins, the repayment period, and who pays repayment-related fees.
Repayment method
For the 2026 academic year, repayment is made in annual installments with equal principal amounts. This applies to students in the School of Future Science, School of System Design and Technology, School of Engineering (Second Division), and School of Science and Technology at the Tokyo Senju or Saitama Hatoyama Campus, as applicable. The same repayment method applies to students in the School of Engineering at the Tokyo Senju Campus.
Repayment period and start
The repayment period is five years. It begins in the academic year following the year in which the borrower completes the master's program or the doctoral program's late stage, or withdraws after completing the prescribed period from either program.
Responsibility for repayment fees
Fees associated with repayment are the responsibility of the loan scholarship recipient. This applies to the 2026 academic year for the School of Engineering, School of Future Science, School of System Design and Technology, School of Engineering (Second Division), and School of Science and Technology within the scopes specified for the Tokyo Senju and Saitama Hatoyama Campuses.
Official sources
The following official Tokyo Denki University materials were used to prepare this page.
- 2026 Student Handbook — School of Engineering (2026 academic year) — PDF page 306
- 2026 Student Handbook — School of Future Science (2026 academic year) — PDF page 241
- 2026 Student Handbook — School of System Design and Technology (2026 academic year) — PDF page 225
- 2026 Student Handbook — School of Engineering II (2026 academic year) — PDF page 254
- 2026 Student Handbook — School of Science and Engineering (2026 academic year) — PDF page 318