TDUQL

Student Relief Scholarship Recruitment Periods

Recruitment is held twice a year, but the stated periods differ by campus, faculty, and academic year.

Recruitment timing by campus and faculty

For the 2025 academic year and the 2026 academic year at Tokyo Senju Campus, recruitment for the Tokyo Denki University Student Relief Scholarship is stated as taking place twice a year, in March and September, for the following faculties: the School of Engineering (Evening Division), the School of Future Science, and the School of System Design and Technology. For the 2025 and 2026 academic years at Saitama Hatoyama Campus, School of Science and Technology, recruitment is stated as taking place twice a year, around April and around September. For the 2026 academic year at Tokyo Senju Campus, School of Engineering, the supplied information includes both recruitment periods around April and September and recruitment periods in March and September; the applicable period is not resolved by the supplied information.

Official sources

The following official Tokyo Denki University materials were used to prepare this page.