Reasons Scholarship Qualification May Be Lost

Scholarship qualification may be lost because of disciplinary action, false information in submitted documents, or unsuitable academic performance or conduct. The applicable grounds differ by academic year, campus, and faculty.

Qualification-loss grounds in 2026

For students in the Faculty of System Design and Technology at Tokyo Senju Campus and the Faculty of Science and Technology at Saitama Hatoyama Campus, receiving a disciplinary action under the school regulations for violating those regulations is listed as a ground for losing scholarship qualification. Examples include expulsion or removal from the register, suspension, and reprimand, among other dispositions.

At Tokyo Senju Campus, submitting false statements or similar entries in documents submitted to the university is a ground for losing qualification when the recipient is deemed unsuitable. Poor academic performance or poor conduct is also a ground when the recipient is deemed unsuitable.

At Saitama Hatoyama Campus, making false statements or similar entries in documents submitted to the university is listed as a ground for losing qualification.

Qualification-loss grounds in 2025

For students in the Faculty of Engineering at Tokyo Senju Campus, scholarship qualification is lost when a student violates the school regulations, receives a disciplinary action such as expulsion or removal from the register, suspension, or reprimand, and is consequently deemed unsuitable as a scholarship recipient. Qualification is also lost when the student has poor academic performance or poor conduct and the university president deems the student unsuitable as a scholarship recipient.

For students in the Faculty of System Design and Technology at Tokyo Senju Campus, receiving a disciplinary action such as expulsion or removal from the register, suspension, or reprimand for violating the school regulations falls under the grounds for losing qualification.

Official sources

The following official Tokyo Denki University materials were used to prepare this page.