TDUQL

Leave of Absence: Application Documents and Approval Process

This page explains the documents, signatures, interviews, fee, approval notice, and possible consequence of not completing the leave-of-absence procedure.

Application Form and Supporting Documents

For the 2025 academic year at Tokyo Senju Campus, System Design and Technology, obtain the leave request form from the Student Welfare Office and complete the required information. The student and guarantor must sign and affix their seals to the form. Submit the required documents to the Student Welfare Office. If the leave is requested because of illness or injury, attach a medical certificate from a doctor. The same submission requirement and medical-certificate requirement also apply to the 2026 academic year at Tokyo Senju Campus for the Faculty of Engineering II.

Required Interviews and Approval

For the 2025 academic year at Tokyo Senju Campus, System Design and Technology, meet first with the student adviser and then with the head of the department. Approval is obtained by having the leave request form stamped. The same interview order and form-stamping process apply to the 2025 academic year at Tokyo Senju Campus for the Faculty of Engineering II. For the 2026 academic year in the Faculty of Engineering II, meet with the student adviser first and then with the head of the department; however, in this faculty, the interview with the head of the department is replaced by an interview with the assistant head of the department.

Fee and Approval Notice

For the 2026 academic year at Tokyo Senju Campus in the Faculty of Engineering II, pay an enrollment-maintenance fee of 30,000 yen per half-year. After the leave-of-absence decision has been made, a leave-of-absence approval notice will be sent by mail.

If the Procedure Is Not Completed

For the 2026 academic year at Tokyo Senju Campus in the Faculty of Future Science, failure to complete the leave-of-absence procedure may result in removal from the university register.

Official sources

The following official Tokyo Denki University materials were used to prepare this page.